Capconsemicon

capconsemicon.com

Capcon,华封科技拥有先进封装设备领域全球技术领先的创始团队和产品技术。服务的客户有台积电、日月光、矽品、⻓电科技、通富微电、DeeTee等.公司产品对先进封装贴片工艺实现了全面覆盖，包括FOWLP(Face Up/Down)、POP、MCM、EMCP、Stack Die、SIP、2.5D/3D、FCCSP、FCBGA等

event-sponsorevent-exhibitor

Contacts

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Tracked editions

Subsidiaries

Active in

Verticals derived from events Capconsemicon has exhibited at.

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Sponsorship history

Capconsemicon has sponsored 1 edition across 1 distinct event · highest tier observed: universal scraped sponsor

Event participation

2026
- SEMICON Chinauniversal-scraped-sponsor

Related companies

Other Atlas-tracked companies sharing an industry tag.

Cite this page

Atlas, “Capconsemicon”, messeatlas.com/companies/f32afae3-9364-4775-a749-9f46c4729e9d, retrieved Jun 1, 2026.